ATV - Reflow Soldering - SRO-716
The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low-volume pilot line, and medium-volume batch production. The system produces high-quality results with outstanding process stability and repeatability. Configuration-dependent, process capabilities include flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing, and flip chip soldering, etc.
Key Features:
- Small Footprint, Freestanding Vacuum Reflow Oven
- Touch TCs with Quick Swap Hotplates
- Maximum Temperature 450°C, (optional 700°C)
- Temperature ramp-up rate 3.5K/sec
- Up to 100 process steps per profile recipe
- Automatic Chamber Opening / Closing
- Optional Top Heating
- Heated Area: 314 x 314 mm
- Oxygen < 1 ppm
- Optional High-Pressure Atmosphere: up to 3 bar (abs)
- Formic Acid, H2, or Solder Paste Activation
Technical Specification
| Footprint | 960 x 760 x 1800mm (LxWxH) |
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| Weight | 240kg. (minimum configuration) |
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| Chamber height | up-to 100mm |
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| Heated area | 314 x 314mm |
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| Chamber lid open/closing | automatic lid closing/opening and locking/unlocking, |
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| Heating method | IR (12pcs. Lamp Array) |
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| Heating Zone | 3 Zones |
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| | For further details, please refer to enclosed brochure. |
ATV Technologie GmbH is a global company established in 1982, specializing in microelectronics and manufacturing and distributing vacuum soldering devices and processing ovens. Their team of engineers and physicists designs and develops high-quality, customized solutions for universities, laboratories, and production companies. ATV has extensive experience in creating process systems with precise temperature control and homogeneity for semiconductor technology and microelectronics, with a worldwide network of representatives for sales and service.
For more information, please contact us:
Hotline: 0906 654 815
Email: tecinfo.vn@dksh.com
