Nordson March - Plasma Treatment - FlexTRAK-SHS
Industry-Leading Throughput and Reliability
Built upon Nordson MARCH’s patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.
Key Features:
Industry-Leading Throughput
- Large capacity F3-S process chamber
- Simultaneous strip buffering and processing
- Advanced automation and magazine splitting capabilities
New Product Development
- Advanced material handling
- Ability to accommodate increasingly larger strip sizes
- Sophisticated jam detection
Application Flexibility
- Plasma chamber effectiveness
- Configurable process chamber
- Versatile treatment modes
Key Applications:
- Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
- Pre-underfill plasma treatment on flip chip packages
- Pre-mold plasma treatment on semiconductor package substrates and lead frames
- Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
- Removal/reduction of oxidation on lead frame
Technical Specifications:
W x D x H – Footprint | 2314 x 1935 x 1787 mm (2293 H mm with light tower)
91.1 x 76.2 x 70.5 in (90.3 H in with light tower) |
Net Weight | 1305 kg (2,871 lbs) |
Chamber Volume | F3-S chamber: 9.6 liters (585 in³)
F3 chamber: 5.5 liters (338 in³) |
Powered Electrode Dimensions W x D | F3-S chamber: 305 x 610 mm (12 x 24 in)
F3 chamber: 305 x 305 mm (12 x 12 in) |
RF Power: Standard Wattage | F3-S chamber: 1000 W
F3 chamber: 600 W |
RF Power: Frequency | 13.56 MHz |
Gas Control: Maximum Number of MFCs | 4 |
| | For further details, please refer to enclosed brochure. |
For more info, please contact us:
Hotline: 0906 654 815
Email: tecinfo.vn@dksh.com
