X8011-III – 2D and 3D X-ray inspection fast, smart, economical and easy
The Viscom X-ray system X8011-III is designed as a team player for individual and reliable use for 2D and 3D X-ray inspection. Thanks to its innovative and simple system operation, the system can be used for manual and automatic X-ray inspection of components, assemblies during production, quality assurance and development – thereby making a sustainable and result-oriented contribution to cost optimization, process reliability and increased product quality. High-quality system components, maximum flexibility through the use of interchangeable modules for perfect specimen handling, as well as simple and intuitive system operation with the option of rapid inspection program creation through to automatic results documentation in the form of professional reports with radiation dose information for X-ray inspection are just some of the highlights of the new X8011-III. Yet more features: the X8011-III X-ray system can be integrated into the production line and intelligently networked with other systems to optimize the manufacturing process.
Highlight
- Seamless, perfect handling of PCB assemblies – even for very large PCBs measuring up to 1,600 mm
- Powerful X-rays with 130 kV or optionally 160 kV
- Unbeatably fast dynamic image acquisition concept Evolution 4 or optionally 5 for even more speed and the highest throughput
- High-precision inspection in 2D, 2.5D and 3D
- High-quality 3D AXI volume calculation with planar CT
- Additional vertical slices for optimum analyses and dependable verification
- Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
- Maximum inspection program optimization through integrated verification
Connectivity
- Use of high-quality system components
- Automated software analyses and inspection programs
- Customer-specific software adaptations
- Robust inspection strategies using the Viscom standard library
- Independent real-time image processing with Viscom analysis tools
- Verification station Viscom HARAN
- Viscom Quality Uplink to AOI, AXI, and SPI for cost optimization and process reliability
- Maximum system uptime thanks to individual service concepts
Inspection
Components: | Electronic components and SMT components (BGA, μBGA, flip chips, and assembled circuit boards) |
Solder joints: | Visible and concealed solder joints |
Defects/defect features: | Air inclusions/blow holes in the solder joint (voids), presence, offset, too much/insufficient solder, solder bridge, solder balls, solder sputter (optional), soldering defects, non-wetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, polarity error, wick-up effect (optional), head-in-pillow (balls), THT fill level and pin height |
Viscom AG is a leading global provider of automatic optical and X-ray inspection systems for electronics production. Viscom AG develops, manufactures, and sells high-quality inspection systems. The product portfolio encompasses the complete bandwidth of optical and X-ray inspection operations, especially in the area of electronics assemblies.
