In the pursuit of excellence, precision is non-negotiable. With the iX7059 One, precision is not just a goal; it is a guarantee. Equipped with state-of-the-art imaging capabilities, this system delivers unrivaled image quality down to an astonishing 1μm resolution. From intricate semiconductor devices to complex leadframe applications, every detail is captured with breathtaking clarity.
But precision extends beyond mere image quality. Its about the ability to identify and address defects with unwavering accuracy. Here, the iX7059 One shines brightest, boasting a greater depth of field that sets a new benchmark in defect detection. Whether it is a subtle flaw or a glaring imperfection, rest assured that nothing escapes the meticulous gaze of this advanced inspection system.
What sets the iX7059 One apart is its versatility. With X-ray Inspection capabilities spanning 2D, 2.5D, and 3D, it is equipped to handle the diverse needs of modern manufacturing. From single semiconductor devices with intricate internal structures to leadframe applications requiring comprehensive analysis, this system delivers flexibility from standalone to unparalleled 100 % inline inspection for production performance across the board.
Highlight
- Resolution down to 1 μm for extremely accurate measurements
- Set a new benchmark in quality assurance with an extended depth of field
- Ultra precise X-ray inspection in real 2D, 2.5D and 3D
- From RnD to inline inspection („Lab-to-Fab“)
- Tailored for semiconductor devices, leadframe applications, and advanced assembly products.
- Modern operating software for extremely fast programming and incredibly simple verification
- Maximum inspection program optimization through integrated verification
- Service, hotline support and remote maintenance worldwide
Connectivity
- Global libraries, global calibration: transferability to all systems
- Automated grayscale value calibration for consistent inspection results
- Traceability, statistical process control, offline programming, multiline verification
- Viscom Quality Uplink: effective networking and process optimization
- Interfaces: SMEMA, SECS/GEM, IPC Hermes Standard (optional)
Inspection
Solder bump inspection, microcracks, void analyses, leadframe inspection, solder layer quality, cold solder joints, solder joint morphology, HiP for solder bumps, wirebond defects, advanced packaging applications.
Viscom AG is a leading global provider of automatic optical and X-ray inspection systems for electronics production. Viscom AG develops, manufactures, and sells high-quality inspection systems. The product portfolio encompasses the complete bandwidth of optical and X-ray inspection operations, especially in the area of electronics assemblies.
