Solder printing and solder jetting are two methods used to apply solder paste to printed circuit boards (PCBs), each with its own advantages and applications. Then how to choose a suitable method for your production? Please go further for detail.
Solder Printing
Process: Utilizes a stencil to apply solder paste through its apertures onto the PCB pads. A squeegee spreads the paste across the stencil, depositing it in specific patterns.
Source: https://www.linkedin.com/pulse/analysis-smt-solder-paste-printing-defects-wendy-wu
Advantages:
- Economical for High Volume: Ideal for large-scale production runs due to its cost-effectiveness.
- Uniform Deposition: Ensures consistent application of solder paste, which is crucial for reliable solder joints.
- Speed: Fast process, especially beneficial for high-volume manufacturing.
Disadvantages:
- Stencil Requirement: Requires custom stencils for each design, which can be costly and time-consuming to produce. Besides that, it is the cost of cleaning paper, cleaning chemical or stencil washing machine, stencil storage, ...
- Limited Flexibility: Not well-suited for designs with very fine pitches or intricate patterns.
Solder Jetting
Process: Directly dispenses solder paste onto the PCB pads using a jetting nozzle, allowing for precise application without the need for stencils.
Source: https://essemtec.com/en/products/dispensing/solder-paste-jet-printing/
Advantages:
- High Precision: Excellent for fine-pitch components and complex pad designs.
- Flexibility: Easily adaptable to design changes without the need for new stencils.
- Minimal Waste: Applies solder paste only where needed, reducing material waste.
Disadvantages:
- Higher Cost: Generally, more expensive due to advanced equipment and technology.
- Speed: Slower compared to stencil printing for large-scale production. Suitable for NPI, low to mid volume.
Choosing the Right Method for your manufacturing
- Solder Printing: Best for high-volume production runs where the design is stable and does not frequently change.
- Solder Jetting: Ideal for prototyping, small to medium batches, and applications requiring high precision and flexibility, such as fine-pitch components, complex designs and Flex PCB.
Conclusion:
The solder jetting becomes more and more important to PCBA quality nowadays. It completes the toughest requirement in every PCB corner, especially in high tech products such as medical devices, automotive, aerospace, defense,...
Together with our partner ESSEMTEC, DKSH brings the newest solder jetting technology to adapt to modern production. Please refer below link for more detail
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