BGA (Ball Grid Array) is a type of electronic component used in circuit boards, characterized by its ball-shaped connections. It is commonly used in integrated circuits due to its compact size and fast signal transmission capabilities. BGA components are essential in various electronic devices such as CPUs, memory modules, and other high-tech products.
BGA Re-balling: BGA Repairing Process
BGA Re-balling is a method used to replace the solder balls of BGA components when they are damaged, cracked, or have poor connections. This process is essential for maintaining the quality and performance of electronic products.
The common method is to re-ball by hand, using a mask. This method is not very accurate and difficult to apply to small or dense solder balls.
Automated Re-balling Method
Essemtec has developed a fully automated re-balling process, simplifying the procedure into two main steps:
Step 1. Dispense flux:
Dispense accurately at high-speed using piezo jetting valve
Step 2. Apply new solder balls:
After dispensing flux, the solder balls will be picked up and attached to the required position
Advantages of automatic re-balling:
- Simplifies the Process: The method does not require highly skilled personnel
- Cost-Effective: There is no need for auxiliary equipment such as masks or jigs
- High Precision and Stability: The process can be applied to difficult products (small solder ball 0.25 mm, high density) with high accuracy.
- Efficiency: The process increases repair speed, ensuring consistent and high-quality results.
Conclusion
BGA is a critical and high-cost component in electronic products. The automated re-balling method not only improves precision and efficiency but also opens the possibility of repairing complex BGA components in the production and assembly of electronic devices. This contributes to the advancement of high technology and promotes sustainable growth in the electronics industry.
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